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1

Handbook of 3D Integration ||

Garrou, Philip, Koyanagi, Mitsumasa, Ramm, Peter

Year:

2014

Language:

english

File:

PDF, 27.78 MB

english, 2014

2

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Impact of deep-via plasma etching process on transistor performance in 3D-IC with via-last backside TSV

Sugawara, Yohei, Hashiguchi, Hideto, Tanikawa, Seiya, Kino, Hisashi, Lee, Kang-Wook, Fukusima, Takafumi, Koyanagi, Mitsumasa, Tanaka, Tetsu

Year:

2015

Language:

english

File:

PDF, 1.12 MB

english, 2015

3

Handbook of 3D Integration || Key Applications and Market Trends for 3D Integration and Interposer Technologies

Garrou, Philip, Koyanagi, Mitsumasa, Ramm, Peter

Year:

2014

Language:

english

File:

PDF, 10.18 MB

english, 2014

4

Onâwafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for throughâsilicon via applications: Comparison to plasmaâenhanced chemical vapor deposition SiO 2

Fukushima, Takafumi, Murugesan, Mariappan, Bea, JiâCheol, Hashimoto, Hiroyuki, Kino, Hisashi, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

Journal of Polymer Science

Year:

2020

File:

PDF, 4.49 MB

2020

5

SiGe elevated source/drain structure and nickel silicide contact layer for sub 0.1 μm MOSFET fabrication

JeoungChill Shim, Hyuckjae Oh, Hoon Choi, Takeshi Sakaguchi, Hiroyuki Kurino, Mitsumasa Koyanagi

Journal:

Applied Surface Science

Year:

2004

Language:

english

File:

PDF, 282 KB

english, 2004

6

Extensive Gene Duplication in the Early Evolution of Animals Before the Parazoan–Eumetazoan Split Demonstrated by G Proteins and Protein Tyrosine Kinases from Sponge and Hydra

Hiroshi Suga, Mitsumasa Koyanagi, Daisuke Hoshiyama, Kanako Ono, Naoyuki Iwabe, Kei-ichi Kuma, Takashi Miyata

Journal:

Journal of Molecular Evolution

Year:

1999

Language:

english

File:

PDF, 933 KB

english, 1999

7

Novel interconnection technology for heterogeneous integration of MEMS–LSI multi-chip module

Kang-Wook Lee, Mitsumasa Koyanagi

Journal:

Microsystem Technologies

Year:

2010

Language:

english

File:

PDF, 786 KB

english, 2010

8

Expression and comparative characterization of Gq-coupled invertebrate visual pigments and melanopsin

Akihisa Terakita, Hisao Tsukamoto, Mitsumasa Koyanagi, Michio Sugahara, Takahiro Yamashita, Yoshinori Shichida

Journal:

Journal of Neurochemistry

Year:

2008

Language:

english

File:

PDF, 430 KB

english, 2008

9

[IEEE 2012 IEEE International Reliability Physics Symposium (IRPS) - Anaheim, CA, USA (2012.04.15-2012.04.19)] 2012 IEEE International Reliability Physics Symposium (IRPS) - Thermomechanical reliability challenges induced by high density Cu TSVs and metal micro-joining for 3-D ICs

Lee, Kangwook, Fukushima, Takafumi, Tanaka, Tetsu, Koyanagi, Mitsumasa

Year:

2012

Language:

english

File:

PDF, 4.28 MB

english, 2012

10

[IEEE 2011 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2011) - Incheon, Korea (South) (2011.07.4-2011.07.7)] 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - 3D LSI and reliability

Koyanagi, Mitsumasa

Year:

2011

Language:

english

File:

PDF, 1.51 MB

english, 2011

11

Impacts of Cu Contamination on Device Reliabilities in 3-D IC Integration

Kang-Wook Lee,, Ji-Chel Bea,, Ohara, Yuki, Murugesan, Mariappan, Fukushima, Takafumi, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 2.26 MB

english, 2014

12

[IEEE 2010 IEEE Custom Integrated Circuits Conference -CICC 2010 - San Jose, CA, USA (2010.09.19-2010.09.22)] IEEE Custom Integrated Circuits Conference 2010 - Three-dimensional integration technology using through-si via based on reconfigured wafer-to-wafer bonding

Koyanagi, Mitsumasa, Fukushima, Takafumi, Tanaka, Tetsu

Year:

2010

Language:

english

File:

PDF, 666 KB

english, 2010

13

New Three-Dimensional Wafer Bonding Technology Using the Adhesive Injection Method

Matsumoto, Takuji, Satoh, Masakazu, Sakuma, Katsuyuki, Kurino, Hiroyuki, Miyakawa, Nobuaki, Itani, Hikotaro, Koyanagi, Mitsumasa

Journal:

Japanese Journal of Applied Physics

Year:

1998

Language:

english

File:

PDF, 1.06 MB

english, 1998

14

Development of Three-Dimensional Integration Technology for Highly Parallel Image-Processing Chip

Lee, Kang Wook, Nakamura, Tomonori, Sakuma, Katsuyuki, Park, Ki Tae, Shimazutsu, Hiroaki, Miyakawa, Nobuaki, Kim, Ki Yoon, Kurino, Hiroyuki, Koyanagi, Mitsumasa

Journal:

Japanese Journal of Applied Physics

Year:

2000

Language:

english

File:

PDF, 334 KB

english, 2000

15

3D-LSI technology for image sensor

Motoyoshi, Makoto, Koyanagi, Mitsumasa

Journal:

Journal of Instrumentation

Year:

2009

Language:

english

File:

PDF, 2.40 MB

english, 2009

16

Impact of Chip-Edge Structures on Alignment Accuracies of Self-Assembled Dies for Microelectronic System Integration

Ito, Yuka, Fukushima, Takafumi, Kino, Hisashi, Lee, Kang-Wook, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

Journal of Microelectromechanical Systems

Year:

2016

Language:

english

File:

PDF, 2.10 MB

english, 2016

17

[IEEE 2015 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2015.8.31-2015.9.2)] 2015 International 3D Systems Integration Conference (3DIC) - Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC

Kino, Hisashi, Hashiguchi, Hideto, Tanikawa, Seiya, Sugawara, Yohei, Ikegaya, Shunsuke, Fukushima, Takafumi, Koyanagi, Mitsumasa, Tanaka, Tetsu

Year:

2015

Language:

english

File:

PDF, 1.03 MB

english, 2015

18

Heterogeneous 3-D Integration Using Self-Assembly and Electrostatic Bonding

Koyanagi, Mitsumasa, Fukushima, Takafumi, Lee, Kang-Wook, Tanaka, Tetsu

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2016

Language:

english

File:

PDF, 3.43 MB

english, 2016

19

Recent progress in 3D integration technology

Koyanagi, Mitsumasa

Journal:

IEICE Electronics Express

Year:

2015

Language:

english

File:

PDF, 9.51 MB

english, 2015

20

Handbook of 3D Integration || Temporary Bonding and Debonding at TOK

Garrou, Philip, Koyanagi, Mitsumasa, Ramm, Peter

Year:

2014

Language:

english

File:

PDF, 1.07 MB

english, 2014

21

Handbook of 3D Integration || The 3M™ Wafer Support System (WSS)

Garrou, Philip, Koyanagi, Mitsumasa, Ramm, Peter

Year:

2014

Language:

english

File:

PDF, 466 KB

english, 2014

22

Handbook of 3D Integration || Metrology Needs for 2.5D/3D Interconnects

Garrou, Philip, Koyanagi, Mitsumasa, Ramm, Peter

Year:

2014

Language:

english

File:

PDF, 2.76 MB

english, 2014

23

[IEEE 2017 IEEE International Interconnect Technology Conference (IITC) - HsinChu, Taiwan (2017.5.16-2017.5.18)] 2017 IEEE International Interconnect Technology Conference (IITC) - Feasibility study of Cu paste printing technique to fill deep via holes for low cost 3D TSV applications

Hai, Hoang Tri, Lee, Kang-Wook, Ando, Daisuke, Sutou, Yuji, Koyanagi, Mitsumasa, Koike, Junichi

Year:

2017

Language:

english

File:

PDF, 850 KB

english, 2017

24

[IMPERIAL COLLEGE PRESS Proceedings of the Final Symposium of the Tohoku University 21st Century Center of Excellence Program - Sendai International Center, Japan (7 – 9 January 2007)] Future Medical Engineering Based on Bionanotechnology - BIOLOGICALLY INSPIRED VISION CHIP FABRICATED USING 3-DIMENSIONAL INTEGRATION TECHNOLOGY

KURINO, HIROYUKI, NAKAGAWA, YOSHIHIRO, NAKAMURA, TOMONORI, YAMADA, YUSUKE, LEE, KANG-WOOK, TANAKA, TETSU, KOYANAGI, MITSUMASA

Language:

english

File:

PDF, 693 KB

english

25

[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - New concept of TSV formation methodology using Directed Self-Assembly (DSA)

Fukushima, Takafumi, Murugesan, Mariappan, Ohsaki, Shin, Hashimoto, Hiroyuki, Bea, Jichoel, Lee, Kang-Wook, Tanaka, Tetsu, Koyanagi, Mitsumasa

Year:

2016

Language:

english

File:

PDF, 2.22 MB

english, 2016

26

[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) for high yield exascale 2.5/3D integration applications

Lee, Kangwook, Nakamura, Ai, Bea, Jicheol, Fukushima, Takafumi, Ramalingam, Suresh, Wu, Xin, Tanaka, Tanaka, Koyanagi, Mitsumasa

Year:

2016

Language:

english

File:

PDF, 3.59 MB

english, 2016

27

[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed TiSix for via-last TSV technology

Mariappan, Murugesan, Bea, JiChel, Fukushima, Takafumi, Motoyoshi, Makoto, Tanaka, Tetsu, Koyanagi, Mitsumasa

Year:

2016

Language:

english

File:

PDF, 534 KB

english, 2016

28

Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration

Fukushima, Takafumi, Konno, Takayuki, Iwata, Eiji, Kobayashi, Risato, Kojima, Toshiya, Murugesan, Mariappan, Bea, Ji-Chel, Lee, Kang-Wook, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

Year:

2011

Language:

english

File:

PDF, 1.40 MB

english, 2011

29

Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration

Fukushima, Takafumi, Hashiguchi, Hideto, Yonekura, Hiroshi, Kino, Hisashi, Murugesan, Mariappan, Bea, Ji-Chel, Lee, Kang-Wook, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

Year:

2016

Language:

english

File:

PDF, 4.07 MB

english, 2016

30

Co-expression of opsins in the eye photoreceptor cells of the terrestrial slug Limax valentianus

Matsuo, Ryota, Koyanagi, Mitsumasa, Nagata, Akane, Matsuo, Yuko

Journal:

The Journal of Comparative Neurology

Year:

2019

Language:

english

File:

PDF, 17.65 MB

english, 2019

31

[IEEE 2019 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2019.10.8-2019.10.10)] 2019 International 3D Systems Integration Conference (3DIC) - Cu-Cu Bonding Challenges with âi-ACFâ for Advanced 3D Integration

Kurooka, Shunji, Hotta, Yoshinori, Nakamura, Ai, Koyanagi, Mitsumasa, Fukushima, Takahumi

Year:

2019

File:

PDF, 1.25 MB

2019

32

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Tight-Pitch Au-Sn Interconnections for 3D-ICs Integration and Packaging Applications

Mariappan, Murugesan, Koyanagi, Mitsumasa, Fukushima, Takafumi

Year:

2020

File:

PDF, 704 KB

2020

33

[IEEE 2020 International Symposium on VLSI Design, Automation and Test (VLSI-DAT) - Hsinchu, Taiwan (2020.8.10-2020.8.13)] 2020 International Symposium on VLSI Design, Automation and Test (VLSI-DAT) - 3D Heterogeneous Integration Technology for AI System

Koyanagi, Mitsumasa

Year:

2020

File:

PDF, 466 KB

2020

34

New LSI with optical interconnection for parallel processing

Mitsumasa Koyanagi, Shin Yokohama

Journal:

Optics & Laser Technology

Year:

1993

Language:

english

File:

PDF, 140 KB

english, 1993

35

Morphological change of Co-nanodot on SiO2 by thermal treatment

Koji Ueda, Taizoh Sadoh, Atsushi Kenjo, Fumiya Shoji, Kaoru Sato, Hiroyuki Kurino, Mitsumasa Koyanagi, Masanobu Miyao

Journal:

Thin Solid Films

Year:

2006

Language:

english

File:

PDF, 589 KB

english, 2006

36

A novel doping technology for ultra-shallow junction fabrication: boron diffusion from boron-adsorbed layer by rapid thermal annealing

Ki-Seon Kim, Yun-Heub Song, Ki-Tae Park, Hiroyuki Kurino, Takashi Matsuura, Kazuhiro Hane, Mitsumasa Koyanagi

Journal:

Thin Solid Films

Year:

2000

Language:

english

File:

PDF, 331 KB

english, 2000

37

Analysis of GOI-MOSFET with high-k gate dielectric and metal gate fabricated by Ge condensation technique

Mungi Park, Jicheol Bea, Takafumi Fukushima, Mitsumasa Koyanagi

Journal:

Surface and Interface Analysis

Year:

2006

Language:

english

File:

PDF, 631 KB

english, 2006

38

SpongePaxcDNA Related toPax-2/5/8and Ancient Gene Duplications in thePaxFamily

Daisuke Hoshiyama, Hiroshi Suga, Naoyuki Iwabe, Mitsumasa Koyanagi, Naruo Nikoh, Kei-ichi Kuma, Fumihiko Matsuda, Tasuku Honjo, Takashi Miyata

Journal:

Journal of Molecular Evolution

Year:

1998

Language:

english

File:

PDF, 1.32 MB

english, 1998

39

Molecular Evolution of Arthropod Color Vision Deduced from Multiple Opsin Genes of Jumping Spiders

Mitsumasa Koyanagi, Takashi Nagata, Kazutaka Katoh, Shigeki Yamashita, Fumio Tokunaga

Journal:

Journal of Molecular Evolution

Year:

2008

Language:

english

File:

PDF, 1.22 MB

english, 2008

40

Identification and characterization of a protostome homologue of peropsin from a jumping spider

Takashi Nagata, Mitsumasa Koyanagi, Hisao Tsukamoto, Akihisa Terakita

Journal:

Journal of Comparative Physiology A: Neuroethology, Sensory, Neural, and Behavioral Physiology

Year:

2010

Language:

english

File:

PDF, 1.01 MB

english, 2010

41

Gq-coupled Rhodopsin Subfamily Composed of Invertebrate Visual Pigment and Melanopsin

Mitsumasa Koyanagi, Akihisa Terakita

Journal:

Photochemistry and Photobiology

Year:

2008

Language:

english

File:

PDF, 759 KB

english, 2008

42

Counterion displacement in the molecular evolution of the rhodopsin family

Terakita, Akihisa, Koyanagi, Mitsumasa, Tsukamoto, Hisao, Yamashita, Takahiro, Miyata, Takashi, Shichida, Yoshinori

Journal:

Nature Structural and Molecular Biology

Year:

2004

Language:

english

File:

PDF, 581 KB

english, 2004

43

Tungsten Through-Silicon Via Technology for Three-Dimensional LSIs

Kikuchi, Hirokazu, Yamada, Yusuke, Ali, Atif Mossad, Liang, Jun, Fukushima, Takafumi, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

Japanese Journal of Applied Physics

Year:

2008

Language:

english

File:

PDF, 700 KB

english, 2008

44

Memory cell design of optically coupled three-dimensional common memory

Hirokazu Takata, Hiroki Mori, Masataka Hirose, Mitsumasa Koyanagi

Journal:

Electronics and Communications in Japan (Part II: Electronics))

Year:

1990

Language:

english

File:

PDF, 722 KB

english, 1990

45

Three-dimensional memory LSI with optical interconnections

Mitsumasa Koyanagi, Hirokazu Takata, Hiroshi Okano, Shin Yokoyama

Journal:

Electronics and Communications in Japan (Part II: Electronics))

Year:

1993

Language:

english

File:

PDF, 1.04 MB

english, 1993

46

A new two-dimensional analysis method for polycrystalline-silicon tfts

So Yamada, Noriji Kato, Mitsumasa Koyanagi

Journal:

Electronics and Communications in Japan (Part II: Electronics))

Year:

1993

Language:

english

File:

PDF, 668 KB

english, 1993

47

Evolution and diversity of opsins

Akihisa Terakita, Emi Kawano-Yamashita, Mitsumasa Koyanagi

Journal:

Wiley Interdisciplinary Reviews: Membrane Transport and Signaling

Year:

2012

Language:

english

File:

PDF, 323 KB

english, 2012

48

Cephalochordate Melanopsin: Evolutionary Linkage between Invertebrate Visual Cells and Vertebrate Photosensitive Retinal Ganglion Cells

Mitsumasa Koyanagi, Kaoru Kubokawa, Hisao Tsukamoto, Yoshinori Shichida, Akihisa Terakita

Journal:

Current Biology

Year:

2005

Language:

english

File:

PDF, 289 KB

english, 2005

49

Expression analyses of visual pigments in the four-layered retina of jumping spider

Takashi Nagata, Mitsumasa Koyanagi, Shigeki Yamashita, Fumio Tokunaga

Journal:

Comparative Biochemistry and Physiology Part B: Biochemistry and Molecular Biology

Year:

2006

Language:

english

File:

PDF, 67 KB

english, 2006

50

Relationships between the diversity of opsins and that of photoreceptive systems

Mitsumasa Koyanagi

Journal:

Comparative Biochemistry and Physiology Part B: Biochemistry and Molecular Biology

Year:

2006

Language:

english

File:

PDF, 57 KB

english, 2006

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